Semi-Automatic Dicing Machine for Demanding Materials
SS20PLUS – Especially Designed for Hard Materials
The semi-automatic dicing machine SS20PLUS is specially developed for the precise processing of thick substrates and hard-to-machine materials such as glass, ceramics, and wafers up to 200 mm in diameter. With its powerful spindle and intuitive operation, it offers an ideal combination of high precision and user comfort.
Application Areas of the Dicing Machine
- Dicing of thick substrates
- Grooving of hard and brittle materials (glass, ceramics)
- Processing of wafers up to Ø 200 mm and square wafers up to 250 mm
- Compatible with 3- to 5-inch dicing blades
Key Advantages of the SS20PLUS at a Glance
- High precision and repeatability (±0.002 mm)
- Powerful 2.5 kW spindle with up to 30,000 rpm
- Compact design with minimal space requirements
- Easy operation via 17-inch touchscreen and intuitive GUI
- Compatible with AD/SS series software for familiar control interface
- Flexible blade change from Ø 76 mm to Ø 130 mm – Compatible with blades from Ø 76 to Ø 130 mm
- High throughput thanks to servo-driven axes (X, Y, Z)
Technical Specifications of the Dicer
- Max. workpiece size: Ø 200 mm, 250 mm for square wafers
- Spindle power: 2.5 kW
- Max. spindle speed: 30,000 rpm
- Feed speed (X-axis): 0.1–300 mm/s
- Y-axis positioning accuracy: ±0.002 mm (over 310 mm)
- Y-axis repeatability: ±0.001 mm
- Dimensions (W×D×H): 890 × 1,090 × 1,625 mm
- Weight: 832 kg
User Comfort
- 17-inch touchscreen with user-friendly GUI
- Automated setup and recipe management
- Unified control concept with AD/SS series machines
- Space-saving design with high efficiency
The SS20PLUS combines precision, performance, and ease of use in a compact, high-performance dicing machine. It is the ideal solution for companies looking to efficiently and reliably process materials with demanding specifications.
Contact our expert team for a customized consultation.
Explore Our Full Product Line
Download the product overview to see how our solutions can support your needs.
Find the right blades for you:
Ensure maximum performance, precision and process reliability – precisely tailored to your application.
Resin Bond Dicing Blade for glass and ceramics →
Resin Bond Dicing Blade for QFN and DFN packages →
Metal Bond Dicing Blade for glass and quartz →
Metal Bond Dicing Blade for modern electronics processing →
Metal Bond Dicing Blade for high-performance ceramics →
Ultra-hard Metal Dicing Blade for non-ferrous metals →
Hub Dicing Blade for silicium →
Nickel Bond Dicing Blade for wafer and substrates →
Nickel Bond Dicing Blade for ceramics →
Nickel Bond Dicing Blade for raw ceramics and hard materials →
Maximum performance with the right machine accessories:
Find efficient water treatment and cleaning solutions for your dicer process.
WR30X PLUS: Efficient Water Treatment for Wafer Dicing →
TD2A-3S / TD1A-S: CO₂ Add-On System for Wafer Dicing →
P102E: Additive Dispensing system for Wafer Dicing →
P103: Additive Dispensing with Diaphragm Pump Technology for Wafer Dicing →
A-CS-300: Automatic Cleaning System for Wafer Dicing →
