The Semi-Automatic Dicing Machine for the Toughest Challenges
SS30PLUS – Specifically Designed for Demanding Materials
The SS30PLUS is engineered to meet the highest demands when cutting brittle and thick materials such as glass and ceramics. It processes 300 mm wafers and substrates up to 300 × 250 mm with outstanding precision. Its robust design and powerful 2.5 kW spindle ensure excellent results – consistently and reliably, even with challenging workpieces.
Your Benefits at a Glance
- High process stability – Low-vibration construction for clean cuts, even with hard materials
- High throughput – Fast servo-driven X, Y, and Z axes for greater daily output
- Wide range of applications – Supports large diamond blades (3″ to 5″) for grooving and precision cutting
- Easy operation – Intuitive 17″ touchscreen and proven GUI from the AD/SS series
- Customizable – Tailored table sizes and software functions to match your specific processes
- Future-proof – Software features and options for custom recipe management and automation
Technical Highlights
- Max. workpiece size: Ø 300 mm or 300 × 250 mm
- Spindle power: 2.5 kW, up to 30,000 rpm
- Axis precision: repeatability up to 0.001 mm
- Compact design: 890 × 1,090 × 1,625 mm
- Weight: 840 kg
Want to see the SS30PLUS dicing machine in action or request a customized quote?
Find the right blades for you:
Ensure maximum performance, precision and process reliability – precisely tailored to your application.
Resin Bond Dicing Blade for glass and ceramics →
Resin Bond Dicing Blade for QFN and DFN packages →
Metal Bond Dicing Blade for glass and quartz →
Metal Bond Dicing Blade for modern electronics processing →
Metal Bond Dicing Blade for high-performance ceramics →
Ultra-hard Metal Dicing Blade for non-ferrous metals →
Hub Dicing Blade for silicium →
Nickel Bond Dicing Blade for wafer and substrates →
Nickel Bond Dicing Blade for ceramics →
Nickel Bond Dicing Blade for raw ceramics and hard materials →
Maximum performance with the right machine accessories:
Find efficient water treatment and cleaning solutions for your dicer process.
WR30X PLUS: Efficient Water Treatment for Wafer Dicing →
TD2A-3S / TD1A-S: CO₂ Add-On System for Wafer Dicing →
P102E: Additive Dispensing system for Wafer Dicing →
P103: Additive Dispensing with Diaphragm Pump Technology for Wafer Dicing →
A-CS-300: Automatic Cleaning System for Wafer Dicing →
