CMP Equipment for the Highest Demands in Semiconductor Manufacturing
What is CMP (Chemical Mechanical Planarization)?
CMP — Chemical Mechanical Planarization — is a key process to create smooth, planar surfaces on semiconductor wafers. Especially for low-k materials or material stacks with varying hardness, CMP is indispensable, as purely mechanical methods would cause steps or defects.
Why Choose ACCRETECH CMP Systems?
Our ChaMP series CMP machines offer:
- Superior surface quality through precise polishing technology
- Modular design for maximum flexibility
- Automated processes with integrated wafer handling and cleaning
