High-Performance CMP Systems for Wafers up to 200 mm

ChaMP 211 / 232

The ChaMP 211/232 series from Accretech offers precise and reliable CMP machines specifically designed to meet the requirements of 200 mm wafer manufacturing. Modular, compact, and flexible – ideal for process reliability and excellent surface quality.

Your Advantages at a Glance

  • Maximum process reliability thanks to the optimal interaction of all components
  • Modular and compact design for easy integration into your production line
  • Polishing head with Air-Float technology for gentle and uniform polishing
  • End Point Detection (EPD) for highly precise, reproducible polishing
  • Dry-in/Dry-out process with cleaning option for contamination-free wafer transfer
  • Easy maintenance thanks to well-thought-out system design

Who is the ChaMP 211/232 Series Suitable For?

  • Semiconductor manufacturers with 200 mm wafer lines
  • Production sites focused on process reliability and surface quality
  • Development departments and foundries

Contact us to learn more about Accretech’s powerful CMP solutions.

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