High-Performance CMP System for 300 mm Wafers
ChaMP 332
The ChaMP 332 from Accretech is a powerful CMP system designed for 300 mm wafer processing — engineered for maximum process reliability, uniform polishing results, and highest efficiency in mass production.
The compact, modular design combined with state-of-the-art polishing technology makes the ChaMP 332 the ideal solution for demanding manufacturing environments.
Overview of ChaMP 332 Advantages
- Highly precise polishing
Thanks to Air-Float technology in the polishing head and integrated End Point Detection (EPD) for uniform material removal. - Optimized for high volume
With three polishing tables and two polishing heads, the ChaMP 332 is ideal for high throughput in mass production. - Dry-in / Dry-out process
Optionally integrable cleaning unit for consistently dry wafer transfer — reduces particles and improves yield. - Modular design & easy maintenance
Compact design and well-thought-out construction for quick maintenance and minimal downtime. - Versatile material compatibility
Suitable for Cu, W, STI, ILD, SOI, and other semiconductor materials.
The ChaMP 332 is ideal for:
- Semiconductor manufacturers with 300 mm production lines
- Foundries with high throughput requirements
- Companies with the highest demands for surface quality and process control
Our experts are happy to help you find the perfect CMP solution for your manufacturing needs.
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