High-Rigidity Grinder for Ultra-Hard Wafers up to 300 mm – HRG300
Semi-automatic grinder for SiC, GaN & sapphire wafers – with in-process measurement, automatic dressing, and batch grinding up to 300 mm.
The HRG300 is a semi-automatic high-rigidity grinder designed for efficient processing of wafers up to 300 mm in diameter – optimized for ultra-hard materials such as SiC, GaN, or sapphire. Thanks to its robust construction and vibration-minimizing design, the system delivers high grinding speed with maximum process stability.
Key Benefits of the HRG300:
- Optimized for ultra-hard materials: ideal for advanced semiconductor manufacturing
- In-process thickness measurement: ensures maximum precision during grinding
- Automatic dressing function: detects tool clogging and reconditions the grinding wheel as needed
- Batch grinding capability: also supports wafers smaller than 300 mm
- High mechanical stability: minimizes grinding damage and shortens processing time
- Self-sharpening function: extends tool life
- Versatile applications: suitable for MEMS wafer handling and custom processes
The HRG300 is the perfect solution for anyone demanding the highest quality, efficiency, and flexibility in modern semiconductor manufacturing.
Contact us now to maximize precision and efficiency in your wafer processing!
