Fully Automatic High-Rigidity Grinder for Ultra-Hard Wafers – HRG300A
Precision and automation combined for ultra-hard wafer grinding up to 300 mm — maximizing throughput and minimizing operator effort.
The HRG300A is a fully automatic high-rigidity grinder designed for precise processing of wafers up to 300 mm. Developed for demanding materials like silicon carbide (SiC), sapphire, lithium niobate (LiNb), and lithium tantalate, this system delivers maximum process stability and efficiency — also suitable for batch mode.
Your Benefits with the HRG300A:
- Fully automated grinding process: for reproducible results and minimal operator intervention
- Highest precision: TTV < 0.5 µm / WTW thickness variation < ±1 µm
- In-process wafer thickness measurement: ideal for single production and batch grinding
- Automatic dressing function: detects grinding wheel clogging and self-corrects
- Self-sharpening technology: extends grinding tool lifetime
- Robust machine design: reduces grinding damage and minimizes cycle times
The HRG300A is suitable for single 300 mm wafers as well as simultaneous processing of smaller wafer sizes — e.g., for MEMS, power electronics, and sensor manufacturing.
Discover how the HRG300A automates, refines, and economically optimizes your wafer production.
