Highly Precise Polish Grinder for Wafer Thinning and Defect Removal up to 300 mm
Integrated thinning and polishing processes in one system for maximum efficiency and flawless results in high-volume manufacturing
The PG3000RMII from ACCRETECH is a highly precise polish grinder solution that combines wafer thinning and defect removal for wafers up to 300 mm in a single system. By integrating multiple process steps into one device, the system achieves maximum efficiency and stable results – ideal for use in high-volume manufacturing.
Maximum Efficiency Through Integrated Processes
- Two processing steps in one machine: thinning and polishing
- Flawless results thanks to stable process control
- Wafer thinning down to 15 µm thickness – for modern applications with ultra-thin substrates
- High throughput for mass production
- All processes on one chuck – no wafer transfer necessary
The RM200/300 module optimally supports polish grinding by:
- • Removing protective tape from thin wafers
- Precisely mounting wafers onto dicing frames
Our product experts are happy to advise you regarding the PG3000RMII polish grinder!
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