High-Precision Edge Grinding for Wafers up to 300 mm
W-GM-5200
The W-GM-5200 is your reliable solution for precise and secure wafer edge grinding for large wafers up to 300 mm. Designed for various materials such as GaAs, SiC, and GaN, this machine guarantees exceptional rotational accuracy and sharp edge profiles with its newly developed grinding unit.
With state-of-the-art contactless measurement technology, the system measures wafer thickness, diameter, and notch depth at multiple points before and after the grinding process, ensuring seamless quality control and maximum process reliability. The innovative mirror-finish technology reduces grinding damage and ensures premium surface quality.
Your Benefits at a Glance:
- Secure and precise processing of large wafers up to 300 mm
- Continuous, high-precision quality control for flawless results
- Versatile for different wafer materials and compounds
- Efficient, space-saving design with easy operation
Optimize your wafer manufacturing with the W-GM-5200 – contact us for personalized consultation and tailored solutions!
