Precision Edge Grinding for the New Generation of 450 mm Wafers
W-GM-6200
The W-GM-6200 is specifically designed to meet the challenges of the latest 450 mm wafers, offering maximum precision in profiling large wafers. With its compact design, it optimizes your production space while integrating cutting-edge technologies for seamless quality control.
Thanks to synchronized X, Y, θ support control, the machine achieves superior grinding accuracy, reducing scrap and ensuring wafer stability throughout the subsequent manufacturing process. The intuitive touch panel simplifies operation, while the automated feedback on processing results streamlines your workflow, reducing response times.
Your Benefits at a Glance:
- Precise grinding of large 450 mm wafers for the highest process quality
- Space-saving, compact design for optimal space utilization
- Intuitive operation via a modern touch panel
- Automated feedback for faster process adjustments and reduced scrap
- Best preparation for subsequent manufacturing steps
Experience how the W-GM-6200, with cutting-edge technology, takes your wafer production to the next level. Contact us for personalized consultation and tailored solutions!
