Dicing Machines from ACCRETECH
Precise Singulation for Every Wafer Size
ACCRETECH dicing machines singulate wafers reliably and with high precision. They are suitable for various wafer diameters – from small batch production to mass production. Whether semi-automatic or fully automatic: ACCRETECH offers the right solution for your needs.
Benefits You Get with Our Dicing Machines
- Compact design – saves space in production
- High process speed and stability
- Fast and precise wafer singulation with minimal material loss
