Fully Automatic Dicing Machine with Integrated Wafer Handling
AD3000T-HC PLUS – Dicing System for 300 mm Wafers with FOUP Cassette and Frame Handling Support
The AD3000T-HC PLUS is a fully automatic dicing machine specifically designed for Φ300 mm wafers, delivering top-tier precision in semiconductor manufacturing. Based on the proven design of the AD3000T-PLUS, this model adds extended features and flexibility to support a wide range of applications—from partial cuts to full dicing operations.
Innovative Features for Maximum Efficiency
- Flexible Wafer and Frame Handling:
The system supports both wafer handling via FOUP cassettes and frame handling using standard cassettes. - Space-Saving Layout:
With its diagonal configuration, up to five AD3000T-HC PLUS units can be installed in the same area typically required for just four standard machines. - Built-In FOUP Opener (Standard):
Automatically opens and closes the FOUP lid, minimizing wafer damage and environmental exposure during wafer batch handling. - Active Z-Axis Height Correction:
The Active-Z feature compensates for variations in the cutting table surface, ensuring consistent and accurate cutting depth. - Increased Productivity and Shorter Processing Time:
Achieve faster cycle times with an X-axis speed of up to 1,000 mm/s, Y-axis speed of 300 mm/s, and Z-axis speed of 80 mm/s.
User-Friendly Operation
The AD3000T-HC PLUS features a 17-inch touchscreen interface with intuitive icon-based controls for streamlined operation.
Technical Specifications of the AD3000T-HC PLUS
- Maximum Workpiece Size: Φ305 mm
- Maximum Supported Frames: 12-inch (SEMI G74-0699)
- Spindle Speed: 60,000 rpm
- Max. Blade Diameter: Φ60 mm
- X-Axis: Cutting Range 310 mm, Max. Speed 1,000 mm/s
- Y-Axis: Cutting Range 310 mm, Max. Speed 300 mm/s
- Z-Axis: Stroke 34 mm, Max. Speed 80 mm/s
- Repeatability: 0.001 mm
- Power Consumption: Max. 6.0 kVA
- Dimensions: 1,290 mm × 1,530 mm × 1,900 mm
- Weight: 1,330 kg
Network Integration & Remote Access
The AD3000T-HC PLUS can be integrated with the Saw-NET network management system. This optional feature allows for remote monitoring and control of multiple machines from your office.
Boost your production speed and precision with the AD3000T-HC PLUS!
Find the right blades for you:
Ensure maximum performance, precision and process reliability – precisely tailored to your application.
Resin Bond Dicing Blade for glass and ceramics →
Resin Bond Dicing Blade for QFN and DFN packages →
Metal Bond Dicing Blade for glass and quartz →
Metal Bond Dicing Blade for modern electronics processing →
Metal Bond Dicing Blade for high-performance ceramics →
Ultra-hard Metal Dicing Blade for non-ferrous metals →
Hub Dicing Blade for silicium →
Nickel Bond Dicing Blade for wafer and substrates →
Nickel Bond Dicing Blade for ceramics →
Nickel Bond Dicing Blade for raw ceramics and hard materials →
Maximum performance with the right machine accessories:
Find efficient water treatment and cleaning solutions for your dicer process.
WR30X PLUS: Efficient Water Treatment for Wafer Dicing →
TD2A-3S / TD1A-S: CO₂ Add-On System for Wafer Dicing →
P102E: Additive Dispensing system for Wafer Dicing →
P103: Additive Dispensing with Diaphragm Pump Technology for Wafer Dicing →
A-CS-300: Automatic Cleaning System for Wafer Dicing →
