Wafer Probing Systems by Accretech

Wafer probing performs the electrical functional test of integrated circuits before the wafer is singulated. The wafer is precisely positioned on an XY stage. Fine needles contact the chip’s bond pads, enabling direct electrical testing—with the highest accuracy and across the full temperature range.

Accretech offers a broad portfolio of fully automatic wafer probers characterized by the highest precision, high throughput, and maximum flexibility—meeting test requirements in development, production, and quality assurance.