Chemical mechanical planarisation (CMP), often called chemical mechanical polishing, is a procedure to level thin layers. CMP was originally developed for use with typical semiconductor materials but is also being increasingly used in manufacturing microsystems. CMP is essential for low-K materials and for wafers being manufactured whose surface consists of a composite material made up of two materials for example. Due to the different levels of hardness and electricity of both materials, purely mechanical processing in this case would lead to notches in the material transition areas.

≤ 200 mm

High Performance CMP Technology for volume production of wafers with a 200 mm diameter. Combined with the assembly of the wafer loader, this becomes a fully automatic unit.

 ChaMP 211/232

≤ 300 mm

Compact, modular and reliable. For 300 mm wafers with the best surface quality. In addition to the wafer loader, a cleaning unit can also be integrated for precise cleaning.

 ChaMP 311/332