High Rigid Grinding

Wafers are now not only manufactured from silicon, but also from very hard materials such as SIC, sapphire, Si or GaN. Extremely stable and low vibration ACCRETECH High Rigid Grinders are the method of choice for these materials. The thinly polished wafers are easier to separate, and have a higher throughout, than thicker wafers in subsequent wafer dicing, the wear of the blade material is lower. The risk of hairline cracks or splitting during Wafer Dicing can also be significantly reduced by the Wafer Edge Grinding.

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≤ 200 mm

Quick, high performance grinding machine for hard materials up to 200 mm. Grinds one SIC wafer in 1 minute to 120 µm.

 HRG200X

≤ 300 mm

Quick, high performance grinding machine for hard materials, for example SiC, GaN and sapphire up to 300 mm

 HRG300
 HRG300A

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