Wafer Probing

Wafer Probing is used after the integrated circuits are applied to the wafers. To do this, the wafers are mounted on an xy-unit and connect to the contact pads (connection pads) with very thin pins. Since the test equipment connected to these pins only provides the individual chips with a voltage, it tests the correct functioning of each individual chip at the same time. The function test in the front-end process can fail in a more significant and intensive way than at a later point in time if only contactless inspection is possible.

≤ 200 mm Wafer Prober

The right solution for every requirement: from proven, fully automatic basic models to ultra-quick high end models with the highest precision in a large temperature range.


≤ 300 mm Wafer Prober

Higher throughput and +-1,5 µm precision for wafers up to 300 mm diameter. It can be adapted to all testing environments and makes simple handling and navigation possible.


Wafer and Frame Prober

Flexibility at a high level. The Frame Handling Prober can be used for both testing ultra-thin wafers and for wafers on the dicing frame.


Key Features

High Voltage

High Current

Vaccum-less handling (MEMS)


Group Index

Bump Probing

Color Camera

Super-high Magnification camera

Mini environment (ISO xx)


Thin Wafer

Ultra Thin Wafer

Top-side handling

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