Wafer Probing

Wafer Probing is used after the integrated circuits are applied to the wafers. To do this, the wafers are mounted on an xy-unit and connect to the contact pads (connection pads) with very thin pins. Since the test equipment connected to these pins only provides the individual chips with a voltage, it tests the correct functioning of each individual chip at the same time. The function test in the front-end process can fail in a more significant and intensive way than at a later point in time if only non-contact inspection is possible.